Heat sink based on the vapour chamber cooling
Flat heat sinks in complex geometries for extremely reliable cooling
Vapor chamber cooling offers even better heat spreading compared to the already innovative heat pipes. The functional principle of a vapour chamber is based on the evaporation and condensation of a liquid within a closed system. This system typically consists of a flat, hermetically sealed copper housing in which a vacuum exists.
Advantages of vapor chamber cooling systems
- Efficient heat dissipation of large amounts of heat
- Space-saving flat design ideal for confined installation spaces
- Improved contact with heat sources due to the flat shape
- Ambient fluids such as water or methanol possible
- Position-independent and passive function for high operational stability and reliability
- Very complex geometries and designs can be realised
- Various surface finishes possible
(nickel plating, painting, powder coating, etc.)
The vapor chamber is lined with a wick structure and contains a small amount of liquid, usually water. If an electronic component attached to it - such as a CPU or GPU - generates heat loss, the liquid vaporises and absorbs this heat. The resulting vapour moves to the cooler areas of the chamber. There, the vapor condenses and releases the heat. The condensed liquid is transported back to the warmer areas through the wick structure and the cooling cycle begins again.
Heat sink variants for Vapour Chamber
Due to their efficient heat distribution technology, vapour chamber heat sinks are particularly suitable for increasing cooling performance in combination with other cooling technologies. Their flat shape enables better contact with the heat source and can absorb large amounts of heat, making them a valuable addition to complex cooling systems.
Vapour Chamber+ profile heat sink
The operating principle of the vapour chamber accelerates the heat spread, the heat is efficiently dissipated from the source to the fins of the profiled heat sink. The cooling fins ensure an even distribution of heat over a large surface area and avoid hotspots. The vapour chamber is significantly lighter than a solid copper plate and is therefore also a weight-saving option. In addition, the low temperature gradient prevents excessive thermal stress on the components.
Vapour Chamber+ soldering
The rapid heat spread enables efficient heat transfer over the entire surface of the soldered heat sink, while the lower weight compared to solid copper plates facilitates handling and integration into systems. Even heat distribution ensures optimised cooling performance by avoiding hotspots.
Vapour Chamber+ heat pipe
Vapour chambers make it possible to save weight by eliminating the need for extensive heat sinks, while heat pipes can also effectively dissipate heat over longer distances. In any case, the heat pipes ensure even and rapid heat distribution. The large surface area in a small space enables efficient heat absorption.
Vapour Chamber+ bonded fin
Even in combination with bonded cooling fins, the functional principle of the vapour chamber offers accelerated heat dispersion. The heat is efficiently dissipated from the source to the cooling fins. The Bonded Fin Heatsink ensures an even distribution of heat over a large surface area and avoids hotspots. Compared to the alternative solid copper plate, the Vapor Chamber is significantly lighter. In addition, the low temperature gradient reduces the risk of excessive thermal stress on the components.
Let's talk about your cooling task!
Lynne Albring
Sales Department
+49 (0)7561 9837-50
l.albring@ekl-ag.de
Make an appointment Enquiries by e-mail
Lynne Albring
Sales Department
+49 (0)7561 9837-50
l.albring@ekl-ag.de
Make an appointment Enquiries by e-mail
Vapor chamber cooling systems for demanding electronics
With its flat design, vapor chamber cooling is ideal for many industrial and high-performance electronics applications. This technology is frequently used in high-performance notebooks, smartphones, servers and high-performance LED lights. A vapor chamber cooling system is able to absorb and reliably distribute a large amount of heat even in confined spaces. A vapor chamber heatsink enables a more even temperature distribution and improved cooling performance compared to traditional cooling methods and even better than heat pipes.
Very complex geometries can be realised during production, allowing heat to be dissipated quickly in a confined space. Multiple direct contacts to the heat source with a contact pressure of up to 90 PSI, coupled with simple installation, make additional base plates and clamps unnecessary. Vapor chamber cooling is not only extremely reliable, it can also be used flexibly: Vapor Chamber cooling performance is less affected by gravity than heatpipe heatsinks. A vapor chamber heat sink can be mounted in practically any position.
Added value and extras
Our full service goes beyond the mere development, series production and logistics of your heat sinks. Do you need special bores or milling on your heat sinks? Do you want your heat sink to not only dissipate a lot of heat, but also look stylish? Would you like a product ready-to-plug-in with all accessories?
Welcome to EKL!
Welcome to EKL!
CNC machining
For prototypes, small series and customised reworking of heat sinks, we have modern 3- and 5-axis CNC milling machinesat our company headquarters. Complex machined and high-precision radiators are our speciality. Working areas of the machines:
Hermle C 400 (5-axis) 850 x 700 x 500 mm | Mikron VCE1000pro (3-axis) 1000 x 560 x 600 mm | Kondia B1050 (3-axis): 1000 x 500 x 600 mm
Hermle C 400 (5-axis) 850 x 700 x 500 mm | Mikron VCE1000pro (3-axis) 1000 x 560 x 600 mm | Kondia B1050 (3-axis): 1000 x 500 x 600 mm
Surface finishing
Our range includes various surface finishes to create a durable, corrosion-resistant surface. Nickel plating increases wear resistance and lustre. Chromating and passivation, especially with Surtec 650, provide additional protection against corrosion. Powder coating is another option for a robust and durable coloured surface. Painting and cathodic dip coating round off our wide range of surface colours and textures.
Attachments & accessories
Depending on the application, screws, springs or push pins ensure the secure and stable attachment of the heat sinks. Backplates provide additional stability and improved heat dissipation. Heat-conducting pastes and pads are naturally part of our range to enable optimum heat transfer between the heat sink and the heat source.
Secure packaging for transport
With a focus on perfect protection during transport, we develop packaging that not only fits perfectly but is also robust. Another important aspect of the range is the use of recyclable materials that contribute to sustainability and environmental friendliness.
Vapor Chamber in typical areas of application
Vapor Chamber heat sinks are used in many applications due to their high efficiency in heat dissipation. This technology uses the phase change from liquid to vapour to distribute heat quickly and evenly over the entire surface of the chamber. It is frequently used in high-performance notebooks and smartphones in particular, but also in servers and LED products. Due to their flat design, they are also ideal for all applications where space is limited.
- 30 years of experience
- Engineering in Germany
- Full Service Heat Sink
- Cost-efficient development
- Fast market launch
- Maximum quality
The EKL project stages for your cooling solutionChoose your point of entry!
Our offer is as flexible as your needs. Are you still early in the development phase and want an idea generator for the best cooling solution? Do you have a ready-made device that gets too hot? Or are you simply looking for an alternative or additional supplier for a heat sink already used in series production? In EKL you will always find a flexible, agile and responsible partner for the cooling of your electronic components and complete systems, whatever the project phase. We look forward to your enquiry!
Counselling
Concept
Concept
In personal contact and open dialogue with you, our engineers create the creative space and framework to design the best cooling solution for your requirements from the wealth of options available.
Development
Feasibility / simulation
Feasibility / simulation
We test the idea for your heat sink virtually in the thermal simulation. Realistic computer simulations allow variations in manufacturing processes, system structures and other parameters.
Performance optimisation
Even a well-functioning heat sink can still be optimised. We determine the "how" and "how much" by simulating different materials or cooling technologies, for example, as well as simulating various environmental parameters.
Cost optimisation
An expensive heat sink can often be made significantly cheaper by using an alternative manufacturing process. Whether with the same or application-specific performance: we support your product development in reducing costs.
Production drawing
Prototype construction
Prototype construction
Prototypes from our design department enable early testing and targeted solutions to problems in your device. We create your functional and design prototypes with our in-house CNC production.
Series production
small to large
small to large
By manufacturing in-house and in Asia, we can offer all types of heat sinks from small to large series at competitive unit prices. We impress our long-standing customers with our consistently high quality.
Sampling
Incoming goods inspection
Incoming goods inspection
We make no compromises when it comes to quality: Development takes place in Germany and all series products are analysed by our German test laboratory according to test plans using state-of-the-art methods.
Surface finishing
Anodising, powder coating, painting etc. protect your heat sinks from corrosion and environmental influences. But colour is not just chic, because dark-coloured heat sinks also emit more radiant heat.
Assemblies
Pre-assembly
Pre-assembly
We actively relieve your production with pre-assembled assemblies. This reduces your workload per device and guarantees the highest quality, because as cooling professionals we ensure that the heat sink is optimally attached.
Quality assurance
Test plans
Test plans
We test according to our own and customer-specific test plans using the latest rapid thermal measuring equipment, 3D measuring machines, assembly tests and testing of various application scenarios.
Packaging design
Packaging production
Packaging production
EKL develops and produces customised packaging to optimally protect your sensitive heat sinks or assemblies in the sometimes harsh transport and storage environments.
Warehouse
& Logistics
& Logistics
With large storage capacities, we offer production-related stocking and consignment warehouses, just-in-time deliveries, customised delivery schedules and flexible shipping options for your individual requirements.
Direct comparison of vapour chamber manufacturing processes
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| Extruded heat sinks | Cold forged heat sinks | Soldered heat sinks | Bonded cooling fins | Pressed cooling fins | Friction stir welding | Heatpipes | Vapour Chamber | Crimped heat sinks | Skived Fins | Die casting | Laserwelding | Vacuum brazing | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Thermal conductivity | |||||||||||||
| Heat dissipation over long distances | |||||||||||||
| Design freedom and flexibility in shape and size | |||||||||||||
| Low tool costs / initial investment | |||||||||||||
| Favourable unit prices | |||||||||||||
| Low set-up costs | |||||||||||||
| Economic efficiency for small series | |||||||||||||
| Economic efficiency for large series | |||||||||||||
| Can be combined with other technologies | |||||||||||||
| Surface finishing / resistance | |||||||||||||
| Heat transfer | |||||||||||||
| Standard products | |||||||||||||
| Material density | n.a. | n.a. | n.a. | n.a. | n.a. | n.a. | |||||||
| Space-saving, large surface area in a small space | |||||||||||||
| Weight-saving | |||||||||||||
| Position dependence / gravity dependence | |||||||||||||
| Machinability | |||||||||||||
| Mechanical stability | |||||||||||||
| Low wear and tear | |||||||||||||
| Homogeneity (material, no additional materials) | |||||||||||||
| Suitability for large coolers | |||||||||||||
| Suitability for small coolers |
• less suitable | ••••• excellently suited | n.a.: not applicable
Let's talk about your cooling task!
Frank Sichler
Sales Manager
+49 (0)7561 9837-47
f.sichler@ekl-ag.de
Make an appointment Enquiries by e-mail
Frank Sichler
Sales Manager
+49 (0)7561 9837-47
f.sichler@ekl-ag.de
Make an appointment Enquiries by e-mail